LIQUID HIGH SOLIDS BINDER COMPOSITION
The invention described herein pertains to substantially formaldehyde free, curable, thermosetting liquid high solids binder compositions, which are free of solid particles, comprising a primary or secondary polyetheramine and a carbohydrate, wherein the binder concentration is at least 35% solids,...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | The invention described herein pertains to substantially formaldehyde free, curable, thermosetting liquid high solids binder compositions, which are free of solid particles, comprising a primary or secondary polyetheramine and a carbohydrate, wherein the binder concentration is at least 35% solids, having rapid cure times on thermal curing and slow cure times at ambient temperatures so that the uncured binder compositions and products which comprise the uncured binder compositions have improved shelf lives.
La présente invention concerne des compositions de liant, à teneur élevée en matières solides, liquides, thermodurcissables, exemptes de formaldéhyde, ayant des temps de durcissement rapides lors d'un thermodurcissement et des temps de durcissement lents aux températures ambiantes de telle sorte que les compositions de liant non durcies et les produits qui comprennent les compositions de liant non durcies ont des durées de conservation améliorées. |
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