LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE

The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110 °C to about 130 °C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufactur...

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Bibliographische Detailangaben
Hauptverfasser:	XENIDOU, MARIA, HU, YUHONG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110 °C to about 130 °C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers. La présente invention a pour objet des adhésifs qui conviennent pour une application à l'aide d'un procédé thermofusible à une température relativement basse se situant dans la plage allant d'environ 110 °C à environ 130 °C. De tels adhésifs montrent des propriétés viscoélastiques souhaitables et conviennent pour lier une fixation élastique lors de la fabrication d'articles jetables, tels que des couches jetables.