COPPER PRERINSE FOR ELECTRODEPOSITABLE COATING COMPOSITION COMPRISING YTTRIUM

A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substr...

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Bibliographische Detailangaben
Hauptverfasser:	MCMILLEN, MARK, ZIEGLER, TERRI L
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES APPARATUS THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FILLING PASTES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.