METHODS FOR MANUFACTURING AN ELECTRICAL CONTACT PAD AND ELECTRICAL CONTACT

The present invention relates to a method for manufacturing an electrical contact pad, including a pad mounting and at least one contact layer, and moreover relates to a method for manufacturing an electrical contact, including a contact mounting and at least one contact layer. Said methods include...

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Bibliographische Detailangaben
Hauptverfasser:	BOURDA, CHRISTINE, ROLLAND, GILLES, JEANDIN, MICHEL
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY RELAYS SELECTORS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a method for manufacturing an electrical contact pad, including a pad mounting and at least one contact layer, and moreover relates to a method for manufacturing an electrical contact, including a contact mounting and at least one contact layer. Said methods include a step of depositing, by means of cold gas dynamic spraying, a first powder onto said pad or contact mounting so as to form said contact layer, said first powder containing at least particles including grains made of at least one refractive material, said grains being built into a matrix made of conductive metal selected from among silver or copper. The invention also relates to the pads and to the electrical contacts obtained in said respective manufacturing methods. La présente invention concerne un procédé de fabrication d'un plot de contact électrique comprenant un support de plot et au moins une couche de contact, ainsi qu'un procédé de fabrication d'un contact électrique comprenant un support de contact et au moins une couche de contact. Lesdits procédés comprennent une étape de dépôt, par projection dynamique par gaz froid, d'une première poudre sur ledit support de plot ou de contact pour former ladite couche de contact, ladite première poudre contenant au moins des particules comprenant des grains d'au moins un matériau réfractaire incorporés dans une matrice à base de métal conducteur choisi parmi l'argent ou le cuivre. L'invention concerne également les plots et les contacts électriques obtenus par lesdits procédés de fabrication respectifs.