SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE

The present invention relates to a solution and a method for activating the oxidized surface of a substrate, in particular of a semiconducting substrate, for its subsequent coating by a metal layer deposited by the electroless method. According to the invention, this composition contains: A) an acti...

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Bibliographische Detailangaben
Hauptverfasser:	MEVELLEC, VINCENT, SUHR, DOMINIQUE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a solution and a method for activating the oxidized surface of a substrate, in particular of a semiconducting substrate, for its subsequent coating by a metal layer deposited by the electroless method. According to the invention, this composition contains: A) an activator consisting of one or more palladium complexes: B) a bifunctional organic binder consisting one or more organosilane complexes; C) a solvent system consisting one or more solvents for solubilizing the said activator and the said binder. Application: Fabrication of electronic devices such as in particular integrated circuits in particular three-dimensional. La présente invention porte sur une solution et sur un procédé pour activer la surface oxydée d'un substrat, en particulier d'un substrat semi-conducteur, pour son revêtement ultérieur par une couche métallique déposée par le procédé autocatalytique. Selon l'invention, cette composition contient : A) un activateur comprenant un ou plusieurs complexes de palladium ; B) un liant organique bifonctionnel comprenant un ou plusieurs complexes d'organosilane ; C) un système de solvant comprenant un ou plusieurs solvants pour solubiliser ledit activateur et ledit liant. Application : fabrication de dispositifs électroniques, tels que, en particulier, des circuits intégrés, en particulier à trois dimensions.