LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE

The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190?C. The adhesive is particularly useful in th...

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Bibliographische Detailangaben
Hauptverfasser:	DEJESUS, M. CRISTINA B, POLLOCK-DOWNER, ALETHEA, XENIDOU, MARIA, HU, YUHONG, SHARAK, MATTHEW
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190?C. The adhesive is particularly useful in the construction of nonwoven articles. L'invention concerne un adhésif thermofusible à basse température d'application. Plus particulièrement, l'adhésif thermofusible à basse température d'application comprend des copolymères oléfiniques avec un indice de fusion moyen supérieur à 5 mais inférieur à environ 35 g/10 minutes à 190°C. L'adhésif est particulièrement utile dans la construction d'articles non tissés.