CURABLE RESIN COMPOSITION AND CURED RESIN

Disclosed is a curable epoxy resin composition which has excellent toughness and is thus hardly fractured, and ex-hibits good adhesion to other materials, while maintaining excellent heat resistance and elastic modulus intrinsic to epoxy resins. In addition, the curable epoxy resin composition has e...

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Bibliographische Detailangaben
Hauptverfasser:	KUNIMITSU, YUMI, OSHITA, SHINYA, ASADA, MITSUNORI, KISHI, HAJIME, IMADE, JIN, MORISHITA, YOSHIHIRO
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is a curable epoxy resin composition which has excellent toughness and is thus hardly fractured, and ex-hibits good adhesion to other materials, while maintaining excellent heat resistance and elastic modulus intrinsic to epoxy resins. In addition, the curable epoxy resin composition has excellent weather resistance, solvent resistance and the like. The curable epoxy resin composition contains 1-70 parts of an epoxy resin curing agent and 1-50 parts of an acrylic block copolymer per 100 parts of an epoxy resin. The acrylic block copolymer contains one or more polymer blocks A composed of a structural unit derived from an alkyl methacrylate ester and one or more polymer blocks B composed of a structural unit derived from an alkyl acrylate ester, while having a weight average molecular weight (Mw) of 30,000-300,000, a molecular weight distribution (Mw/Mn) of not more than 1.5, and a content ratio of the polymer blocks A of 3-60% by mass. A cured resin composed of the curable epoxy resin composition is also disclosed.