LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE COMPOSITION AND ARTICLES INCLUDING THE SAME

A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.

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Bibliographische Detailangaben
Hauptverfasser: EICHLER-JOHNSON, BETH M, ROGACHEVSKY, VITALY
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.