ROOM TEMPERATURE CURING ADHESIVE COMPOSITION HAVING HIGH TEMPERATURE PROPERTIES

Room temperature curing structural adhesive compositions including polyur ethane oligomers having multi-methacrylate functionality, cycloalkylmethacry late, at least one maleimide-functionalized compound and a cure system are d isclosed. These compositions exhibit enhanced high temperature propertie...

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Bibliographische Detailangaben
Hauptverfasser:	VEROSKY, CHRISTOPHER J, LEVANDOSKI, SUSAN LAMTROUNG, CZABAJ, BRIAN M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Room temperature curing structural adhesive compositions including polyur ethane oligomers having multi-methacrylate functionality, cycloalkylmethacry late, at least one maleimide-functionalized compound and a cure system are d isclosed. These compositions exhibit enhanced high temperature properties, i ncluding hot strength, heat/humidity strength, and heat aging strength, with out compromising initial tensile strength and fixture speeds and still posse ssing a room temperature cure.