SEMICONDUCTOR STRUCTURE AND PROCESS FOR FORMING OHMIC CONNECTIONS TO A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND PROCESS FOR FORMING OHMIC CONNECTIONS TO A SEMICONDUCTOR STRUCTURE

A semiconductor apparatus is disclosed. The apparatus includes a first do ped volume of semiconductor material, the first doped volume having a front surface and first and second adjacent regions. The first region has a first concentration of dopant and a first exposed area on the front surface. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: RUBIN, LEONID B
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor apparatus is disclosed. The apparatus includes a first do ped volume of semiconductor material, the first doped volume having a front surface and first and second adjacent regions. The first region has a first concentration of dopant and a first exposed area on the front surface. The s econd region has a second concentration of dopant and a second exposed area on the front surface, the second concentration being higher than the first c oncentration. The apparatus also includes a first external conductor and an alloy bonding the first external conductor to the second exposed area to ohm ically connect the conductor to the second region.