METHOD AND DEVICE FOR ANALYZING A LAYER OF A METAL WORKING COMPOUND ON A PRODUCT TO BE SHAPED

The invention relates to a method for analyzing a layer of a metal working compound (50) on the surface of a product to be shaped (40), especially of a metal strip, before and/or after a shaping process, especially a rolling process, for various measuring variables. According to the invention, analy...

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Bibliographische Detailangaben
Hauptverfasser:	RICHTER, HANS-PETER, PAWELSKI, HARTMUT, KOHLRAUSCH, ARNT
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PHYSICS PUNCHING METAL ROLLING OF METAL TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a method for analyzing a layer of a metal working compound (50) on the surface of a product to be shaped (40), especially of a metal strip, before and/or after a shaping process, especially a rolling process, for various measuring variables. According to the invention, analysis of the metal working compound (50) is carried out by way of spectroscopic analysis. The invention also relates to a method for carrying out the method according to the invention. L'invention concerne un procédé permettant d'analyser une couche d'agent auxiliaire (50) sur la surface d'un produit de déformation plastique (40), notamment une bande métallique, avant et/ou après un processus de déformation, notamment un processus de laminage, en termes de différentes variables à mesurer. A cet effet, il est prévu que l'analyse de l'agent auxiliaire (50) s'effectue par analyse spectrale. L'invention concerne en outre un dispositif pour mettre ledit procédé en oeuvre.