FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS

A fan cooling unit (10) for cooling electronic components, such as for an air- cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) in...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	RUDOLF, CHRISTIANE, SCHWARZ, ROBERT, POON, WAI SING, MULLER, JASON WILLIAM
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PRINTED CIRCUITS SEPARATION TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A fan cooling unit (10) for cooling electronic components, such as for an air- cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) into which a composite filter media (3) is mounted so as to create an air-tight fit. The composite filter media (3) comprises a membrane filtration layer (20) with a porous polymeric membrane, such as expanded polytetrafluoroethylene (ePTFE), and at least one depth filtration layer (18) disposed on an upstream side of the membrane filtration layer (20). The depth filtration media layer comprises fibers having an electrostatic charge. The ePTFE membrane is preferably made from a blend of a PTFE homopolymer and a modified PTFE polymer.