LEAD FREE DESOLDERING BRAID
A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and...
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| creator | MAX, SUSAN D KLEIN, GARY J |
| description | A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.). |
| format | Patent |
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The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.).</description><language>eng ; fre</language><subject>BRAID ; BRAIDING ; BRAIDING MACHINES ; BRAIDING OR MANUFACTURE OF LACE, INCLUDING BOBBIN-NET ORCARBONISED LACE ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; KNITTING ; LACE ; LACE-MAKING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; NON-WOVEN FABRICS ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TEXTILES ; TRANSPORTING ; TRIMMINGS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060824&DB=EPODOC&CC=CA&NR=2595516A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060824&DB=EPODOC&CC=CA&NR=2595516A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAX, SUSAN D</creatorcontrib><creatorcontrib>KLEIN, GARY J</creatorcontrib><title>LEAD FREE DESOLDERING BRAID</title><description>A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. 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The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
| recordid | cdi_epo_espacenet_CA2595516A1 |
| source | esp@cenet |
| subjects | BRAID BRAIDING BRAIDING MACHINES BRAIDING OR MANUFACTURE OF LACE, INCLUDING BOBBIN-NET ORCARBONISED LACE CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING KNITTING LACE LACE-MAKING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-WOVEN FABRICS PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TEXTILES TRANSPORTING TRIMMINGS WELDING WORKING BY LASER BEAM |
| title | LEAD FREE DESOLDERING BRAID |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T14%3A26%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MAX,%20SUSAN%20D&rft.date=2006-08-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECA2595516A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |