LEAD FREE DESOLDERING BRAID

A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAX, SUSAN D, KLEIN, GARY J
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.).