INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING
A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30). L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des pro...
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| creator | DODD, SIMON TOM, DENNIS W WANG, S. JONATHAN MILLER, RICHARD TODD MCMAHON, TERRY E HINDMAN, GREGORY T BRYANT, FRANK R |
| description | A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).
L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30). |
| format | Patent |
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L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; SEMICONDUCTOR DEVICES ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140211&DB=EPODOC&CC=CA&NR=2581938C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140211&DB=EPODOC&CC=CA&NR=2581938C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DODD, SIMON</creatorcontrib><creatorcontrib>TOM, DENNIS W</creatorcontrib><creatorcontrib>WANG, S. JONATHAN</creatorcontrib><creatorcontrib>MILLER, RICHARD TODD</creatorcontrib><creatorcontrib>MCMAHON, TERRY E</creatorcontrib><creatorcontrib>HINDMAN, GREGORY T</creatorcontrib><creatorcontrib>BRYANT, FRANK R</creatorcontrib><title>INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING</title><description>A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).
L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND39AtxdQ9yDHF1UXD2DHIO9QxRcPRzUfB1DfHwd1Fw8w9S8HX0C3VzdA4JDfL0c-dhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfHOjkamFoaWxhbOxoRVAAB0WiUt</recordid><startdate>20140211</startdate><enddate>20140211</enddate><creator>DODD, SIMON</creator><creator>TOM, DENNIS W</creator><creator>WANG, S. JONATHAN</creator><creator>MILLER, RICHARD TODD</creator><creator>MCMAHON, TERRY E</creator><creator>HINDMAN, GREGORY T</creator><creator>BRYANT, FRANK R</creator><scope>EVB</scope></search><sort><creationdate>20140211</creationdate><title>INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING</title><author>DODD, SIMON ; TOM, DENNIS W ; WANG, S. JONATHAN ; MILLER, RICHARD TODD ; MCMAHON, TERRY E ; HINDMAN, GREGORY T ; BRYANT, FRANK R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA2581938C3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>DODD, SIMON</creatorcontrib><creatorcontrib>TOM, DENNIS W</creatorcontrib><creatorcontrib>WANG, S. JONATHAN</creatorcontrib><creatorcontrib>MILLER, RICHARD TODD</creatorcontrib><creatorcontrib>MCMAHON, TERRY E</creatorcontrib><creatorcontrib>HINDMAN, GREGORY T</creatorcontrib><creatorcontrib>BRYANT, FRANK R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DODD, SIMON</au><au>TOM, DENNIS W</au><au>WANG, S. JONATHAN</au><au>MILLER, RICHARD TODD</au><au>MCMAHON, TERRY E</au><au>HINDMAN, GREGORY T</au><au>BRYANT, FRANK R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING</title><date>2014-02-11</date><risdate>2014</risdate><abstract>A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).
L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS |
| title | INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING |
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