INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING

A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30). L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des pro...

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Bibliographische Detailangaben
Hauptverfasser:	DODD, SIMON, TOM, DENNIS W, WANG, S. JONATHAN, MILLER, RICHARD TODD, MCMAHON, TERRY E, HINDMAN, GREGORY T, BRYANT, FRANK R
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30). L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).