THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS

A solder preform (5,12) having multiple layers including a solder layer fill ed with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder materi al filled with additives, and an unfilled surface layer for improved wettabi...

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Bibliographische Detailangaben
Hauptverfasser:	INGHAM, ANTHONY, LAUGHLIN, JOHN P, SINGH, BAWA, LEWIS, BRIAN, KYAW, DAVID V
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder preform (5,12) having multiple layers including a solder layer fill ed with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder materi al filled with additives, and an unfilled surface layer for improved wettabilit y. Among the fillers are CTE modifying components and/or a thermal conductivity enhancement components.