THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

The invention relates to a thin-film assembly (1) comprising a substrate (2) and at least one electronic thin-film component (8) that has been applied to the substrate using thin-film technology. The substrate is equipped with a base electrode (4) that is provided with thin-film layers that form part of the thin-film component (8), in addition to an upper top electrode (9). The substrate (2) is configured as a printed circuit board that is known per se, comprising an insulation material base body (3) and a metal lining that acts as a conductor layer (5), the latter (5) forming the base electrode (4) and being polished for this purpose at least at the location of the thin-film component (8). A contact layer (18), created by thin-film technology, is provided between the polished, optionally reinforced conductor layer (5) and the thin-film layers of the thin-film component (8) that lie above said conductor layer, said contact layer being physically or chemically adsorbed on the surface of the base electrode (4).