PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF
A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a dilute aqueous alkali soluti on and that gives a cured film through thermal curing in the postcuring st...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a dilute aqueous alkali soluti on and that gives a cured film through thermal curing in the postcuring step, t he cured film having satisfactory flexibility and being suitable to a solder ma sk ink of high insulation excelling in adherence and resistances to gold platin g, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising ( 1) a urethane resin soluble in aqueous alkali solutions (A), the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecu le (b) and a diol compound having a carboxyl group in its molecule (c) optional ly together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) a photopolymerization initiator (B); and (3) a reactive crosslinking agent (C). |
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