RELEASABLE PROTECTIVE INSULATING LAYERS FOR SUBSTRATES

An improved method of and apparatus for producing preferably thin plastic protective film layers (2) for thin shiny copper foils (1) and the like, as for PCB applications, with electric charge adhering of the same to the foil (1) and with peel-off releasable properties to provide the same original p...

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Bibliographische Detailangaben
1. Verfasser:	WILHEIM, MARTIN J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An improved method of and apparatus for producing preferably thin plastic protective film layers (2) for thin shiny copper foils (1) and the like, as for PCB applications, with electric charge adhering of the same to the foil (1) and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.