FLOOR COVERING
The invention relates to a floor covering consisting of at least two interconnected layers, comprising an electrically conductive rubber lower layer (2) that is arranged below a light-coloured upper rubber layer (1). Th e upper layer (1) is perforated in partial sections that are distributed in a pa...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | The invention relates to a floor covering consisting of at least two interconnected layers, comprising an electrically conductive rubber lower layer (2) that is arranged below a light-coloured upper rubber layer (1). Th e upper layer (1) is perforated in partial sections that are distributed in a pattern over its surface with electrically conductive rubber being embedded in said sections. The upper layer (1) is created by pouring (1.1) first light- coloured particles (1.2), consisting of an electrically insulating rubber on to the lower layer and embedding second particles (1.3) therein, the latter consisting of electrically conductive rubber that is at least pre-vulcanised . The second particles (1.3) have a diameter D, which is determined by screen analysis and is at least equal to the thickness D1 of the upper layer and fo r practical purposes no greater than the sum of the thickness of the upper and lower layer D2. The first (1.2) and the second particles (1.3) are compresse d together and with the lower layer (2) in a pore-free manner and are bonded b y vulcanisation. At least one of the second particles (1.3) is present in a surface area unit of 31.7 cm2~ of the floor covering, with the proviso that the surface area of the second particles (1.3) constitutes a maximum 50 % of the entire surface area of the floor covering. |
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