THICK FILM HEATER APPARATUS

Improved injection molding machine heater apparatus using thick-film layers (26, 28, 32) applied directly on a thermally conductive substrate (34) or directly onto the melt channel. Preferably, the substrate (34) is cylindrically shaped with a slot (24) running the length of the substrate (34). The...

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Bibliographische Detailangaben
Hauptverfasser:	JENKO, EDWARD J, WINKELMANN, BERND D, WARREN, HAROLD M, WOLFF, PETER C, PILAVDZIC, JAMES, BOOTH, ANDREW P
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Improved injection molding machine heater apparatus using thick-film layers (26, 28, 32) applied directly on a thermally conductive substrate (34) or directly onto the melt channel. Preferably, the substrate (34) is cylindrically shaped with a slot (24) running the length of the substrate (34). The thick film layers (26, 28, 32) and substrate (34) have substantial ly equal coefficient of thermal expansion. Preferably, the heater assembly has a lower coefficient of thermal expansion than the machine channel it is installed on so as to increase the thermal communication as they heat up. A heat resistant connector housing (36) is slidably installed over the heater assembly (12) for mechanical connection of conductors to the heater without the use of soldering, brazing, welding or other failure prone connection mea ns.