MINIATURE MICRODEVICE PACKAGE AND PROCESS FOR MAKING THEREOF

The present invention is concerned with a miniature microdevice package (37) and a process of making thereof. The package (37) has a miniature frame substrate (38) made of a material selected form the group including: ceramic , metal and a combination of ceramic and metal. The miniature frame substr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JEROMINEK, HUBERT, ALAIN, CHRISTINE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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