MINIATURE MICRODEVICE PACKAGE AND PROCESS FOR MAKING THEREOF

The present invention is concerned with a miniature microdevice package (37) and a process of making thereof. The package (37) has a miniature frame substrate (38) made of a material selected form the group including: ceramic , metal and a combination of ceramic and metal. The miniature frame substr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JEROMINEK, HUBERT, ALAIN, CHRISTINE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention is concerned with a miniature microdevice package (37) and a process of making thereof. The package (37) has a miniature frame substrate (38) made of a material selected form the group including: ceramic , metal and a combination of ceramic and metal. The miniature frame substrate (38) has a spacer (39) delimiting a hollow (40). The package (37) also includes a microdevice die (41) having a microdevice substrate (44), a microdevice (45) integrated on the microdevice substrate (44), bonding pads (49) integrated on the microdevice substrate (44), and electrical conductors integrated in the microdevice substrate (44) for electrically connecting the bonding pads (49) with the microdevice (45). The microdevice die (41) is mounted on the spacer (39) to form a chamber (48). The microdevice (45) is located within the chamber (48). The bonding pads (49) are located outside o f the chamber (48).