MULTILAYER PRINTED BOARD

The invention relates to a multilayer printed board to be provided with electronic components. Said printed board comprises at least one layer whose thermal expansion behavior approximately corresponds to the thermal expansio n behavior of the electronic components while substantially determining th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KRABE, DETLEF, DIETZ, MATHIAS, SCHEEL, WOLFGANG, CYGON, MANFRED
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to a multilayer printed board to be provided with electronic components. Said printed board comprises at least one layer whose thermal expansion behavior approximately corresponds to the thermal expansio n behavior of the electronic components while substantially determining the thermal expansion behavior of the multilayer printed board.