HIGH DENSITY SUBSTRATE AND METHODS FOR MANUFACTURING SAME

This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using t he substrates to manufacture laminates, circuits, interposers, and other electronic laminates.

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Bibliographische Detailangaben
Hauptverfasser:	GOTRO, JEFFREY T, ANDROFF, NANCY M. W, HEIN, MARC, SMITH, GORDON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using t he substrates to manufacture laminates, circuits, interposers, and other electronic laminates.