METHOD AND ASSEMBLY FOR PRODUCING PRINTING PLATES

Printing plates (2) are formed from a layer of photo polymerizable resin (R) by a process and assembly which includes a back masking negative (38) placed between light sources (42) and a support plate (28) on the non-printing side of the resin layer. A connective substrate (4) is positioned between...

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Bibliographische Detailangaben
1. Verfasser:	STRONG, KENNETH M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTING PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	Printing plates (2) are formed from a layer of photo polymerizable resin (R) by a process and assembly which includes a back masking negative (38) placed between light sources (42) and a support plate (28) on the non-printing side of the resin layer. A connective substrate (4) is positioned between the back mask negative and the resin layer. A negative (44) of the image or images to be formed on the printing plate is positioned on the side of the resin layer which is to form the printing surface (1U) of the plate. Both sides of the resin layer are exposed to UV light, and the back mask negative serves to allow hardening of the resin only in the areas of the resin layer where printing surfaces are located. Thus, a plurality of isolated printing surfaces may be formed on the plate, which printing surfaces are connected together by the connective substrate. In this manner, a photo polymerized floor need not be produced on the printing plates, allowing increased resin recovery after the plate has been formed.