ADHESION-RESISTANT OXYGEN-FREE COPPER ROUGHLY DRAWN WIRE

An adhesion-resistant oxygen-free copper roughly drawn wire not being adhered to each other and being mass-produced at low cost is provided. The adhesion-resistant oxygen-free copper roughly drawn wire contains oxygen in concentration of 1 to 10 ppm and hydrogen in concentration of 1 ppm or less and...

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Bibliographische Detailangaben
Hauptverfasser:	HORI, KAZUMASA, MASUI, TUTOMU, HATTORI, YOSHIAKI, KOSHIBA, YUTAKA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES CHEMISTRY CONDUCTORS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An adhesion-resistant oxygen-free copper roughly drawn wire not being adhered to each other and being mass-produced at low cost is provided. The adhesion-resistant oxygen-free copper roughly drawn wire contains oxygen in concentration of 1 to 10 ppm and hydrogen in concentration of 1 ppm or less and having a gross oxidation film 50 to 500 angstroms in thickness with an oxidation film of Cu2O being present in a part of said gross oxidation film.