BURST-ULTRAFAST LASER MACHINING METHOD

A method of laser processing of materials. The combination of ultrafast laser pulses and high-repetition rate (>1MHz) bursts (or continuous opera tion) defines a new regime for material processing. The high rate controls thermal processes evolving between each ultrafast laser pulse that 'pre...

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Bibliographische Detailangaben
Hauptverfasser:	MARJORIBANKS, ROBIN, HERMAN, PETER R, OETTL, ANTON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BANDAGES, DRESSINGS OR ABSORBENT PADS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS DIAGNOSIS FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION GLASS HUMAN NECESSITIES HYGIENE IDENTIFICATION JOINING GLASS TO GLASS OR OTHER MATERIALS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES MEDICAL OR VETERINARY SCIENCE METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PERFORMING OPERATIONS PROSTHESES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS SURGERY TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of laser processing of materials. The combination of ultrafast laser pulses and high-repetition rate (>1MHz) bursts (or continuous opera tion) defines a new regime for material processing. The high rate controls thermal processes evolving between each ultrafast laser pulse that 'prepares' the sample surface or bulk for optimal interaction with subsequent ultrafast laser pulses. The addition of this laser-controlled thermal component overcomes sever al current limitations of ultrafast laser processing at lower repetition rates (< 1MHz), providing means to fully harness the many attributes by ultrafast lasers for material processing applications.