ROBUST TECHNETIUM REMOVAL METHOD AND SYSTEM

The invention provides a method and processing system (10) for removing both anionic and cationic technetium complexes from an aqueous solution by adjusting the pH of the solution to greater than approximately 2, and directing the solution into an integrated resin and electrochemical plating device...

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Bibliographische Detailangaben
Hauptverfasser:	GRANT, DAVID D, SNYDER, THOMAS S
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F INORGANIC CHEMISTRY METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides a method and processing system (10) for removing both anionic and cationic technetium complexes from an aqueous solution by adjusting the pH of the solution to greater than approximately 2, and directing the solution into an integrated resin and electrochemical plating device (30). The integrated resin and plating device (30) has a resin bed (32) or resin membrane in which is disposed one or more cathodes (38), and one or more anodes (36). A potential generator (34) produces at least a 1 volt potential between the cathodes (38) and anodes (36). As the solution passes through the resin (32), the technetium complexes are absorbed onto it. When a sufficient concentration of technetium complexes is adsorbed, the plating process can alternatively be driven to plate out the technetium onto the cathodes, or to collect various species in system anolytes/catholytes.