COMPACT FLEXIBLE CIRCUIT CONFIGURATION

This invention is a flexible probe constructed using a flexible circuit (10) having a small cross-sectional profile. In the various disclosed embodiments of the flexible circuit (10), a flexible substrate (12) includes a plurality of conductive traces (14, 16) that extend along opposite surfaces of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WISCOMBE, BRENT, CHEN, JAMES C
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:This invention is a flexible probe constructed using a flexible circuit (10) having a small cross-sectional profile. In the various disclosed embodiments of the flexible circuit (10), a flexible substrate (12) includes a plurality of conductive traces (14, 16) that extend along opposite surfaces of the substrate (12). Light emitting devices (18) (or other electronic devices) ar e mounted at spaced-apart intervals along the length of the conductive traces (14, 16) using a conductive adhesive/solder (22). A conductor couples a terminal on the outwardly facing side of each of the light emitting devices (18) to the conductive trace that is disposed on the opposite side of the substrate (12). In one embodiment, this conductor comprises a short conducti ve bar (60) that extends between the terminals of pairs of the light emitting devices (18) that are mounted on opposite sides of the flexible substrate (1 2) so that the pair of light emitting devices (18) are connected in series. In another embodiment, the flexible substrate includes an outwardly extending a rm (108) of the conductive trace that wraps around the edge of the flexible substrate (12) to connect to the light emitting device mounted on the opposi te side thereof. In each embodiment, a substantially smaller cross-sectional profile is achieved compared to a previous approach in which the conductive traces providing power to a light emitting device were located on the same side of the flexible substrate, and fly wires (20) were used to connect the light emitting devices to the conductive traces.