HOT MELT ADHESIVES
Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree.F (177 .degree.C), and a n optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized...
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| creator | QUINN, THOMAS H EICHLER, BETH M DUBOIS, ROBERT A ALBRECHT, STEVEN W KAUFFMAN, THOMAS F LAWRENCE, MAYNARD RICKEY, CYNTHIA L |
| description | Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree.F (177 .degree.C), and a n optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20.alpha.-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 500 0 cPs (50 grams/(cm.second)) at 150 .degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives. |
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In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20.alpha.-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 500 0 cPs (50 grams/(cm.second)) at 150 .degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.</SD OAB></description><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER ; MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070313&DB=EPODOC&CC=CA&NR=2260954C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070313&DB=EPODOC&CC=CA&NR=2260954C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QUINN, THOMAS H</creatorcontrib><creatorcontrib>EICHLER, BETH M</creatorcontrib><creatorcontrib>DUBOIS, ROBERT A</creatorcontrib><creatorcontrib>ALBRECHT, STEVEN W</creatorcontrib><creatorcontrib>KAUFFMAN, THOMAS F</creatorcontrib><creatorcontrib>LAWRENCE, MAYNARD</creatorcontrib><creatorcontrib>RICKEY, CYNTHIA L</creatorcontrib><title>HOT MELT ADHESIVES</title><description>Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree.F (177 .degree.C), and a n optional wax and tackifier. 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In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20.alpha.-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 500 0 cPs (50 grams/(cm.second)) at 150 .degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.</SD OAB></abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER |
| title | HOT MELT ADHESIVES |
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