HOT MELT ADHESIVES

Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree.F (177 .degree.C), and a n optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized...

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Bibliographische Detailangaben
Hauptverfasser:	QUINN, THOMAS H, EICHLER, BETH M, DUBOIS, ROBERT A, ALBRECHT, STEVEN W, KAUFFMAN, THOMAS F, LAWRENCE, MAYNARD, RICKEY, CYNTHIA L
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
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Beschreibung
Zusammenfassung:	Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree.F (177 .degree.C), and a n optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20.alpha.-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 500 0 cPs (50 grams/(cm.second)) at 150 .degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.