LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE

A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KUEPPERS, MICHELLE C
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	KUEPPERS, MICHELLE C
description	A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CA2255793A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CA2255793A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CA2255793A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w_2Agy1FHI_rSQLXJKQn7VaKnJNoof4_Ln6A01ve1omkATBnCYQaUgTlLnNBvRUGnxQ6FoUhqAceiUU4KnhGBYwtUJIWCvehV4zEe7d5zM_VDj93Dq6s5I-2vCdbl_luL_tMhFXVNOdLjaf6j_IFZXYtdA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE</title><source>esp@cenet</source><creator>KUEPPERS, MICHELLE C</creator><creatorcontrib>KUEPPERS, MICHELLE C</creatorcontrib><description>A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.</description><edition>6</edition><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980122&DB=EPODOC&CC=CA&NR=2255793A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980122&DB=EPODOC&CC=CA&NR=2255793A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUEPPERS, MICHELLE C</creatorcontrib><title>LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE</title><description>A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_2Agy1FHI_rSQLXJKQn7VaKnJNoof4_Ln6A01ve1omkATBnCYQaUgTlLnNBvRUGnxQ6FoUhqAceiUU4KnhGBYwtUJIWCvehV4zEe7d5zM_VDj93Dq6s5I-2vCdbl_luL_tMhFXVNOdLjaf6j_IFZXYtdA</recordid><startdate>19980122</startdate><enddate>19980122</enddate><creator>KUEPPERS, MICHELLE C</creator><scope>EVB</scope></search><sort><creationdate>19980122</creationdate><title>LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE</title><author>KUEPPERS, MICHELLE C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA2255793A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1998</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUEPPERS, MICHELLE C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUEPPERS, MICHELLE C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE</title><date>1998-01-22</date><risdate>1998</risdate><abstract>A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre
recordid	cdi_epo_espacenet_CA2255793A1
source	esp@cenet
subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
title	LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T01%3A44%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUEPPERS,%20MICHELLE%20C&rft.date=1998-01-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECA2255793A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true