LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE

LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE

A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KUEPPERS, MICHELLE C
Format: Patent
Sprache:eng ; fre
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.