IMPROVED PLASMA SPRAYING

An apparatus 1 for the plasma spraying of a substrate 2 comprises a reaction chamber 3 at one end of which is located a plasma torch. A plasma forming gas is delivered under pressure to the torch such that a plasma jet is produced which extends along the length of the reaction chamber 3. An inlet po...

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Bibliographische Detailangaben
Hauptverfasser:	CREFFIELD, GEOFFREY KENNETH, COLE, MARK ANDREW, AL-SABOUNI, OMAR
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An apparatus 1 for the plasma spraying of a substrate 2 comprises a reaction chamber 3 at one end of which is located a plasma torch. A plasma forming gas is delivered under pressure to the torch such that a plasma jet is produced which extends along the length of the reaction chamber 3. An inlet port 8 is provided in the torch for the passage therethrough of a powder material and inlet ports 4 are provided in the reaction chamber 3 for injecting a reactive gas such as methane into the plasma jet.