A MOISTURE-CURING COMPOUND

Described is a moisture-curing sealing and bonding compound made from completely synthetic polymers, the compound containing, to improve its non-sag properties, a triglyceride, either as the sole non-sag agent or in addition to prior art agents. The triglyceride should have a melting point over 40 d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KLEIN, JOHANN, MAJOLO, MARTIN, DZIALLAS, MICHAEL, ERNST, WOLFGANG, PODOLA, TORE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Described is a moisture-curing sealing and bonding compound made from completely synthetic polymers, the compound containing, to improve its non-sag properties, a triglyceride, either as the sole non-sag agent or in addition to prior art agents. The triglyceride should have a melting point over 40 deg C, preferably over 50 deg. C, and be derived from saturated fatty acids with 8 to 26 C-atoms. Even without using thixotropic agents, compounds can be obtained which do not sag at temperatures over 40 deg. C. Such joint sealants can be used to fill joints more than 35 mm wide without sagging.