HIGH-POWER DIODE LASER AND METHOD FOR MOUNTING THE SAME

The invention is directed to a high-power diode laser and to a method for mounting same. It is substantial to the invention to provide predetermined breaking locations in the laser bar which, during cooling after the laser bar ha s been soldered to a heat sink having a smaller thermal expansion coef...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	DAIMINGER, FRANZ, DORSCH, FRIEDHELM, HEINEMANN, STEFAN, DOHLE, RAINER, LORENZEN, DIRK
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention is directed to a high-power diode laser and to a method for mounting same. It is substantial to the invention to provide predetermined breaking locations in the laser bar which, during cooling after the laser bar ha s been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the si ngle laser diodes of the laser bar as a result of mechanical stresses can be ruled ou t.