METHOD OF APPLYING A PHOTOSENSITIVE RESIN TO A SUBSTRATE FOR USE IN PAPERMAKING
The invention comprises a method for applying a curable resin, such as a pho tosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; pr oviding a curable liquid resin; providing a second mater ial different from the cura...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | The invention comprises a method for applying a curable resin, such as a pho tosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; pr oviding a curable liquid resin; providing a second mater ial different from the curable liquid resin; applying the second material to the substrate to occupy at least some of the voids in the s ubstrate intermediate the first and second surfaces of the substrate; applying the cu rable resin to the substrate; curing at least some of th e resin to provide a resin layer on the substrate; and removing at least some of the se cond material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable res in to the substrate.
The invention comprises a method for applying a curable resin, such as a photose nsitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; provid ing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material to the sub strate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate; applying the curabl e resin to the substrate; curing at least some of the resin to provide a resin layer on the substrate; and removing at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin t o the substrate. |
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