PROCESS FOR THROUGH-HOLE PLATING OF TWO-LAYER CIRCUIT BOARDS AND MULTILAYERS

PROCESS FOR THROUGH-HOLE PLATING OF TWO-LAYER CIRCUIT BOARDS AND MULTILAYERS

A PROCESS FOR THE THROUGH-HOLE PLATING OF TWO-LAYER CIRCUIT BOARDS AND MULTILAYERS A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit board...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WOLF, GERHARD-DIETER, JONAS, FRIEDRICH
Format: Patent
Sprache:eng ; fre
Schlagworte:
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:A PROCESS FOR THE THROUGH-HOLE PLATING OF TWO-LAYER CIRCUIT BOARDS AND MULTILAYERS A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced. Le A 28 771