COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS

SZ9-90-016 COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS ABSTRACT Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink. The inventive cooling structure consists of a current/voltage supply level with metal stru...

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Hauptverfasser:	BUCHMANN, PETER L, UNGER, PETER, VOEGELI, OTTO, VETTIGER, PETER
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS PHYSICS SEMICONDUCTOR DEVICES
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Zusammenfassung:	SZ9-90-016 COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS ABSTRACT Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink. The inventive cooling structure consists of a current/voltage supply level with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge in thermal connection to the heat transfer structure provides for heat flux between the inventive cooling structure and the heat sink.