POLYIMIDE FILM WITH TIN OR TIN SALT INCORPORATION RESULTING IN IMPROVED ADHESION

16 PE-0273-A TITLE POLYIMIDE FILM WITH TIN OR TIN SALT INCORPORATION RESULTING IN IMPROVED ADHESION A polyimide film having improved adhesion and thermal durability containing from 0.02 to 1% by weight of tin based on the weight of the film. A process for preparing a polyimide film is also described...

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Hauptverfasser:	MILLIGAN, STUART N, RAY, YIAING
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Zusammenfassung:	16 PE-0273-A TITLE POLYIMIDE FILM WITH TIN OR TIN SALT INCORPORATION RESULTING IN IMPROVED ADHESION A polyimide film having improved adhesion and thermal durability containing from 0.02 to 1% by weight of tin based on the weight of the film. A process for preparing a polyimide film is also described wherein a tin (II) or tin (IV) salt is introduced into a filmforming polyamide acid polymer prior to the casting step. 16