VACUUM VAPOR DEPOSITION APPARATUS

An improved vacuum vapor-deposition apparatus comprises an evaporation tank for holding and evaporating vapor deposition material, a hood covering the top of the evaporation tank and extended up to its outside in the horizontal direction, inlet and outlet ports of a band to be vapor-deposited, which are opened in the hood so as to penetrate a central portion of the extension on the outside of the evaporation tank, and a vacuum tank covering the evaporation tank and the hood entirely and having sealing devices for carrying in and carrying out the band to be vapor-deposited at the positions corresponding to the inlet and outlet ports in the hood. Vapor deposition is effected within the hood simultaneously onto the both front and rear surfaces of the band to be vapor-deposited. Preferably, the vacuum vapor-deposition apparatus further comprises a vapor amount control device for controlling a vapor amount of the evaporated material led to the both front and rear sides of the band to be vapor-deposited within the hood, and a vapordeposited surface area control device provided at least on one side of the front and rear sides of the band to be vapor-deposited within the hood for controlling a vapordeposited surface area of the band to be vapor-deposited. Then, vapor-deposition of different thicknesses is effected within the hood onto the front and rear surfaces of the band to be vapor-deposited.