FLAME-RESISTANT POLYORGANOSILOXANE COMPOUND

A flame-resistant, hardenable polyorganosiloxane composition is described wi th a content of 2 to 40 weight % hollow glass balls with an outside diameter of up to 200 .mu.m and 3 to 50 weight % of an inorganic intumescent compound which expands at a temperature form 80 to 250.degree.C. The preferred...

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Bibliographische Detailangaben
Hauptverfasser:	LEROUX, ROLAND, THURK, JURGEN, JONAS, REINHARD
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A flame-resistant, hardenable polyorganosiloxane composition is described wi th a content of 2 to 40 weight % hollow glass balls with an outside diameter of up to 200 .mu.m and 3 to 50 weight % of an inorganic intumescent compound which expands at a temperature form 80 to 250.degree.C. The preferred intumescent compound is expandable graphite. The composition can replace the previous compounds provided with polyhalogenated diphenyl compositions in fireproof windows. A flame-resistant, hardenable polyorganosiloxane compound is described with a content of 2 to 40 weight % hollow glass balls with an outside diameter of up to 200 .mu.m and 3 to 50 weight % of an inorganic intumescent compound which expands at a temperature from 80 to 250.degree.C. The preferred intumescent compound is expandable graphite. The compound can replace the previous compounds provided with polyhalogentated diphenyl compounds in fireproof windows.