THERMOPLASTIC POLYPROPYLENE-POLYAMIDE MOLDING COMPOSITIONS OF HIGH TOUGHNESS, RIGIDITY AND HEAT-DISTORTION RESISTANCE, AND THE PREPARATION THEREOF

- 27 - O.Z. 0050/40883 Novel polypropylene-polyamide molding compositions which comprise, based on 100 parts by weight of the molding compositions, A) 10 to 89.9 parts by weight of one or more poly propylene homopolymer and/or copolymer, B) 10 to 89.9 parts by weight of one or more polyamide, C) 0.1...

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Hauptverfasser:	SEILER, ERHARD, LAUSBERG, DIETRICH, MUELLER, WOLFGANG F
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:	- 27 - O.Z. 0050/40883 Novel polypropylene-polyamide molding compositions which comprise, based on 100 parts by weight of the molding compositions, A) 10 to 89.9 parts by weight of one or more poly propylene homopolymer and/or copolymer, B) 10 to 89.9 parts by weight of one or more polyamide, C) 0.1 to 5.0 parts by weight of one or more olefinic ally unsaturated carboxylic acid and/or one or more olefinically unsaturated carboxylic acid derivate, D) 0 to 30.0 parts by weight of an impact modifier, and E) 0 to 60.0 parts by weight of a reinforcing agent and/or additive, are prepared by melting together components (A), (C) and, if desired (D) at from 200 to 300.degree.C in a first reaction step and then, in a second reaction step, introducing component (B) and, if appropriate, components (D) and/or (E) into the modified melt obtained, and melting together the components. The molding compositions obtained are used for the production of moldings.