PROCESS FOR REFLOW SOLDERING

A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.

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Bibliographische Detailangaben
Hauptverfasser:	BANDYOPADHYAY, NIKHILES, KIRSCHNER, MARK J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.