THERMOSETTING POLYIMIDE PREPOLYMERS

In one embodiment this invention provides novel thermosetting aromatic polyimide prepolymers which have superior solubility and flow properties, and which can be thermally cured to heat and oxidation resistant thermoset adhesives, films, and molded products. Illustrative of a prepolymer is the dimal...

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Bibliographische Detailangaben
1. Verfasser:	CHOE, EUI W
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	In one embodiment this invention provides novel thermosetting aromatic polyimide prepolymers which have superior solubility and flow properties, and which can be thermally cured to heat and oxidation resistant thermoset adhesives, films, and molded products. Illustrative of a prepolymer is the dimaleimide of 2,2-bis¢p,p'-(m-aminophenoxy)phenylsulfonyl(p-phenyleneoxy)-phenyl!propane.