STACKED LEADFRAME ASSEMBLY
STACKED LEADFRAME ASSEMBLY Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected con...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | STACKED LEADFRAME ASSEMBLY Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes. |
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