CAPACITOR UTILIZING CONSOLIDATED STACK OF MUTUALLY LAYERED DIELECTRIC PLIES

A capacitor comprising a consolidated stack of mutually layered dielectric plies which are provided with a respective metal layer as coating. An incision is provided at one side by means of which the individual dielectric plies are lent projections on which, alternating from ply-to-ply, the coatings are interrupted by means of insulating strips so that the metallizations situated on the surfaces formed by the projections alternately connect antipolar coatings to one another. A method of the invention provides that metallized plastic tapes be provided with corresponding, metal-free strips and be thereafter wound onto a drum, whereupon the incisions are produced in the occurring mother capacitors and the individual stacks are subsequently separated from the mother capacitors.