ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS
Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated...
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| creator | SHUE, ROBERT S CHILDERS, CLIFFORD W BEEVER, WILLIAM H |
| description | Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CA1244173A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CA1244173A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CA1244173A3</originalsourceid><addsrcrecordid>eNrjZHB09XN2DAgO9XEMcXVRcPVxdQ4J8vfzdFZw9vcN8Pdz9QsJVnD0A8rAlXn6-0Ekgz1B7GAeBta0xJziVF4ozc0g7-Ya4uyhm1qQH59aXJCYnJqXWhLv7GhoZGJiaG7saExYBQBrOiqN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS</title><source>esp@cenet</source><creator>SHUE, ROBERT S ; CHILDERS, CLIFFORD W ; BEEVER, WILLIAM H</creator><creatorcontrib>SHUE, ROBERT S ; CHILDERS, CLIFFORD W ; BEEVER, WILLIAM H</creatorcontrib><description>Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.</description><edition>4</edition><language>eng ; fre</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; CABLES ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; INSULATORS ; MAKING GRANULES OR PREFORMS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED ; PRINTED CIRCUITS ; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS ; RESISTORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL ; WORKING-UP</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881101&DB=EPODOC&CC=CA&NR=1244173A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881101&DB=EPODOC&CC=CA&NR=1244173A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHUE, ROBERT S</creatorcontrib><creatorcontrib>CHILDERS, CLIFFORD W</creatorcontrib><creatorcontrib>BEEVER, WILLIAM H</creatorcontrib><title>ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS</title><description>Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INSULATORS</subject><subject>MAKING GRANULES OR PREFORMS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</subject><subject>PRINTED CIRCUITS</subject><subject>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</subject><subject>RESISTORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB09XN2DAgO9XEMcXVRcPVxdQ4J8vfzdFZw9vcN8Pdz9QsJVnD0A8rAlXn6-0Ekgz1B7GAeBta0xJziVF4ozc0g7-Ya4uyhm1qQH59aXJCYnJqXWhLv7GhoZGJiaG7saExYBQBrOiqN</recordid><startdate>19881101</startdate><enddate>19881101</enddate><creator>SHUE, ROBERT S</creator><creator>CHILDERS, CLIFFORD W</creator><creator>BEEVER, WILLIAM H</creator><scope>EVB</scope></search><sort><creationdate>19881101</creationdate><title>ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS</title><author>SHUE, ROBERT S ; CHILDERS, CLIFFORD W ; BEEVER, WILLIAM H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA1244173A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1988</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INSULATORS</topic><topic>MAKING GRANULES OR PREFORMS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</topic><topic>PRINTED CIRCUITS</topic><topic>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</topic><topic>RESISTORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SHUE, ROBERT S</creatorcontrib><creatorcontrib>CHILDERS, CLIFFORD W</creatorcontrib><creatorcontrib>BEEVER, WILLIAM H</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHUE, ROBERT S</au><au>CHILDERS, CLIFFORD W</au><au>BEEVER, WILLIAM H</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS</title><date>1988-11-01</date><risdate>1988</risdate><abstract>Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
| recordid | cdi_epo_espacenet_CA1244173A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS RESISTORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
| title | ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T03%3A55%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHUE,%20ROBERT%20S&rft.date=1988-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECA1244173A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |